Kenneth Wyatt Wyatt Technical Services, LLC ken@emc-seminars.comSteve Sandler Picotest steve@picotest.com
Modern devices are continuing a long-term trend of squeezing more electronics into smaller packages, while also increasing system performance, data rates and operating efficiency. Higher efficiencies are often achieved by implementing faster silicon MOSFETs or even faster eGaN FETs while size is reduced by increasing switching frequencies and replacing aluminum and tantalum capacitors with smaller ceramic devices. One result of this trend is that there is greater interaction between the disciplines of EMI, signal integrity (SI) and power integrity (PI).
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